Semiconductor Manufacturing Equipment Market By Front-End Equipment (Lithography, Wafer Surface Conditioning Wafer Cleaning , Deposition, and Other Front-End Equipment), By Back-End Equipment (Assembly and Packaging, Dicing, Metrology, Bonding, and Wafer Testing), By Fab Facility (Automation, Chemical Control, Gas Control, and Others), By Product Type (Memory, Foundry, Logic, MPU, Discrete, and Analog, Mems, and Others), By Dimension (2D, 2.5D, and 3D), By Supply Chain Participant (IDM Firms, Osat Companies, and Foundries), and By Region – Global Opportunities and Forecast, 2020-2027
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